Soldering Defects and Their Causes

Solder crack occurred at the Lead through-hole part, only at the top edge and not inside the barrel. Possibly a void below the solder surface. Yet to perform x-ray on the defective location. What could have been the problem?

Could the component have moved before the solder hardened?

So you see a body lying face down on the sidewalk, not moving and there is some blood on the ground around the head. A cop runs up to you and asks: who murdered this person and why?

We would need more info and you need to do the xray. Otherwise this is just a guess-fest.

Bev D said:

So you see a body lying face down on the sidewalk, not moving and there is some blood on the ground around the head. A cop runs up to you and asks: who murdered this person and why?

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Ahh, but as a retired homicide investigator I'd think murder, suicide, or accident.

Having only a photo to go by limits me so I can offer the results of a search on the subject. This type of problem solving really should be done by someone who has competencies in circuit board assembly and soldering.

Miner said:

Could the component have moved before the solder hardened?

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Thanks for giving me a lead on where I should look next.

How will you know? What evidence are you looking for? What will the X-ray tell you?
Were there other through hole components that have this defect on the board? Where are they?
Is the same component on other boards experiencing the defect?

Had both sides of the connection been heated prior to the solder application?

Is the lead length in spec? could be physical damage from being bumped or flicked or caught on something. What's on the other side?